Sika usa
SikaBond®-T21
SikaBond®-T21 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T21 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.
SikaBond®-T35
SikaBond®-T35 may be used to bond all engineered, solid plank flat milled,shorts, bamboo, cork and parquet hardwood flooring designed by the manufacturer for glue down applications. This adhesive can also be used for many other bonding applications that are common for light commercial and residential applications including acoustic rubber underlayment systems.
SikaLevel®-025 Patch
SikaLevel®-025 Patch is a fast drying, self-curing, polymer-modified, cement-based patching compound that rapidly develops high compressive strength. Use for smoothing, leveling, patching, and filling cracks, holes and voids in concrete and approved wood underlayments prior to the installation of floor coverings. From featheredge to ½” floor coverings can be installed 1 hour after application. Mix with Sika® Latex R to use as an embossing leveler or patch over properly prepared vinyl sheet goods, vinyl composition tile (VCT), cement terrazzo, and residual cutback adhesive surfaces.
Uzin Utz®
Properties:
- Fast setting • Walkable in 2-3 hours
- Versatile • Applies from 1/16″-1″ (1.5-25 mm) depth
- Smooth surface • Improves adhesive coverage rate
- Low stress • Ability to cover difficult substrates
- Excellent mixing properties • Pumpable
- Standard dry time • 24 hours for most floor coverings
Uzin Utz® NC-150
Applications:
- Interior use only
- Producing flat and smooth surfaces for the installation of textile, resilient, ceramic, and engineered wood floor coverings
- Use as a self-leveling layer over existing hard surface flooring such as well bonded terrazzo, ceramic tile, stone, and well bonded epoxy coatings
- Use over structurally sound concrete, APA Exposure Type 1 plywood and OSB, or equally rated subfloor materials
- Renovation of gypsum and portland-based leveling compounds
- Use over well bonded adhesive residues including cutback adhesive*
- Residential and commercial applications
- Use with radiant floor heating systems
Uzin Utz® PE-260
Applications:
- Interior use only
- Concrete substrates up to 85% RH
- Use over portland and gypsum leveling compounds
- Use over well bonded non-water-soluble adhesive residues including cutback adhesive*
- Use over new, structurally sound, OSB underlayment or equally rated subfloor materials
- Residential and commercial applications
- Use with radiant floor heating systems
Properties:
- Highly concentrated (apply undiluted or dilute with water
- Versatile for use over a range of substrate conditions
- High solids content with superior film forming and bonding
Tec® specialty installation systems
Recommended Applications:
- Interior
Set Speed:
- Fast
TEC® Level Set 400 HF
Recommended Substrates:
- When properly prepared, suitable substrates include:
- Concrete
- Ceramic, porcelain or quarry tile
- Pavers
- Cement or epoxy terrazzo
- Cement backerboard
- Metal
- VCT or full glued down, non-cushioned vinyl sheetgoods
- Exterior grade plywood (with reinforcement lath)
- Oriented Strand Board (OSB) (with reinforcement lath)
- Gypsum substrates (properly primed) with minimum tensile bond strength 72 psi (0.5 MPa)
TEC® Multipurpose Primer
Recommended Applications:
- Interior
- Exterior
Recommended Applications:
- Interior
Set Speed:
- Fast
TEC® VersaPatch
Recommended Substrates:
- Existing Concrete
- Concrete Terrazzo
- Cement Backerboard
- Tile
- Masonry
- Epoxy Terrazzo
- Exterior Grade Plywood
- Exterior Grade Lauan Plywood
- Well-bonded Resilient Flooring
- Adhesive Residue
- Gypsum Substrates