Glues and Adhesives
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SikaBond®-T21
SikaBond®-T21 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T21 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.
SikaBond®-T35
SikaBond®-T35 may be used to bond all engineered, solid plank flat milled,shorts, bamboo, cork and parquet hardwood flooring designed by the manufacturer for glue down applications. This adhesive can also be used for many other bonding applications that are common for light commercial and residential applications including acoustic rubber underlayment systems.
SikaLevel®-025 Patch
SikaLevel®-025 Patch is a fast drying, self-curing, polymer-modified, cement-based patching compound that rapidly develops high compressive strength. Use for smoothing, leveling, patching, and filling cracks, holes and voids in concrete and approved wood underlayments prior to the installation of floor coverings. From featheredge to ½” floor coverings can be installed 1 hour after application. Mix with Sika® Latex R to use as an embossing leveler or patch over properly prepared vinyl sheet goods, vinyl composition tile (VCT), cement terrazzo, and residual cutback adhesive surfaces.
Sika® Level-225
Sika® Level-225 is a one-component, durable and versatile cementitious underlayment for interior concrete and cementitious substrates. It can be applied manually or by pump to produce a self-smoothing, rapid-setting, flat and economical substrate prior to the application of a final floor finish. Typical application thickness is 1/16”–1-1/4” (1.5–31 mm).